NST Combinatorial Plasma Sputtering Coater

1 Piece (MOQ)

Business Type Manufacturer, Exporter, Supplier
Brand Name NST
Material Mild Steel
Finishing Polished
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Preferred Buyer From

Location Anywhere in India

Product Details

Sky Blue
Power Source
ISO 9001:2015
220V, 220 VAC
Packaging Type
Single Phase
One Years Limited Warranty With Lifetime Support
Country of Origin
2000 W (including vacuum pump and water chiller)
Net Weight of Coater
160 Kg
Payment Terms
L/C, T/T, Western Union

COMBINATORIAL PLASMA SPUTTERING COATER is also suitable for sequential coating of multiple layer films such as ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE, etc.Compared with similar equipment, it is not only widely used, but also has the advantages of small size and easy operation. It is an ideal equipment for laboratory preparation of material films, especially suitable for laboratory research on solid electrolytes and OLEDs.

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Technical Specifications

Input Power Single phase 220 VAC 50 / 60 Hz
2000 W (including vacuum pump and water chiller)
Source Power Three sputtering power sources are integrated into one control box.
DC source: 500 W power for coating metallic materials.
RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials.
Magnetron   Sputtering Head Three 2″ Magnetron Sputtering Heads with water cooling jackets and shutters are included.
One Sputting Head Model also available.
Target size requirement: 2″ diameter
Thickness range: 0.1 – 5 mm for both metallic and non-conductive targets (including backing plate)
One Stainless Steel Target and one Research Grade Al2O3 target are included for demo testing
Customized coater: Two DC – One RF; Two RF – One DC; Three DC; Three RF
Vacuum   Chamber Vacuum chamber: 300 mm Dia.×300 mm Height, made of stainless steel
Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
Hinged type lid with pneumatic power pole allows easy target change
Sample Stage Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover
Sample holder size: 140 mm Dia. for. 4″ wafer max
Rotation speed: 1 – 20 rpm adjustable for uniform coating
The holder temperature is adjustable from RT to 500 °C max (2h max) with accuracy +/- 1.0 °C via a digital        temperature controller
Gas Flow Control Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gases
Flow rate: 0 – 200 mL/min & 0 – 100ml/min adjustable on the touch screen control panel
Air inlet valve is installed for vacuum release
Vacuum Pump Station A mobile pump station is included. The sputtering coater can be placed on top of station
High-speed turbo pump at speed 80L/S is combined        with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
Standard vacuum level connected with chamber : < 4.0E-5 Torr. .  (1.0E-6 Torr with chamber baking )
Water Chiller One digital temperature controlled recirculating   water chiller is included.
Refrigeration range: 5~35 °C
Flow rate: 16 L/min
Pump pressure: 14 psi
Overall Dimensions Lid closed: 48″ × 28″ × 32″
Lid open: 48″ × 28″ × 37″

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